Intel will release for Altera multichip matrix SiP-pack

	xtreview is your : Video card - cpu - memory - Hard drive - power supply unit source

Recommended : Free unlimited image hosting with image editor

POSTER: computer news   ||   INTEL WILL RELEASE FOR ALTERA MULTICHIP MATRIX SIP-PACK	DATE:2014-03-27
Altera company signed an agreement with TSMC on FPGA-release matrices using 16-nm process technology.  It should be recalled that a year ago, Altera has concluded a similar agreement with Intel, only applied to 14-nm process.   Fresh press release, Intel reported that it extends contract with Altera service multichip packaging chips.  In a 14-nm process technology with Tri-Gate transistors matrix generation Stratix FPGA 10 and SoC Altera will be issued in the form of multichip SiP-packaging.  The company note that we are talking about packaging System-in-a-Package, and not about the newfangled 2,5 D and 3D.  We explain that the package 2,5 D implies partially horizontal arrangement of crystals, using TSVs-connections for mounting crystals on a common substrate, and 3D-packing - a vertical stack of crystals with through TSVs-compounds.  In the case of SiP it also comes as a rule, placing the stack of crystals, but only with external wired strapping (see picture above). According to Intel, use SiP economical than 2,5 D-and 3D-packaging.  At the same time the company has more than 10 years of experience in manufacturing processors XScale, which in addition to the computational core carried chip flash memory and a single crystal of SRAM.  For Altera, Intel will be packaged in a single housing FPGA-matrix, DRAM, SRAM, ASIC, processor, analog components and much more.  Just as importantly, the company has its own facilities for packaging and testing, which makes it a unique contract manufacturer.  TSMC Company, for example, although it is able to produce 2,5 D-combination, packaging and testing orders from contractors. Related Products :

	xtreview is your : Video card - cpu - memory - Hard drive - power supply unit source

Xtreview Support N-Post:xxxx Xtreview Support	INTEL WILL RELEASE FOR ALTERA MULTICHIP MATRIX SIP-PACK
	Please Feel Free to write any Comment; Thanks

Related news:

This year will not be released more than 45 million motherboards (2017-09-08)
AMD Vega 20 will find application in accelerating computations (2017-09-08)
Meizu will release Android-smartphone based on Helio P40 (2017-09-07)
Delivery of virtual reality seats Roto VR will begin in late October (2017-09-05)
Smart watches will outstrip smart bracelets by popularity (2017-09-05)
Compact systems Intel NUC based on Coffee Lake will be released in the second quarter of 2018 (2017-09-05)
Xbox One will get keyboard and mouse support (2017-09-05)
AMD processors with Zen architecture of the second generation will raise frequencies and specific performance (2017-09-05)
Specifications PCIe 4.0 will see the light this year, and PCIe 5.0 in 2019 (2017-08-30)
Samsung Galaxy Tab 8.0 2017 will be launched as Galaxy Tab A2 S (2017-08-28)
IPhone 8 will cost a minimum of 999 dollars (2017-08-28)
In the line of Dell Alienware gaming systems, more affordable models will appear (2017-08-26)
Tesla trunking tractor will not exceed 480 km on electric traction without recharging (2017-08-25)
Expansion of 10-nm Intel processors range will be on 2018 (2017-08-24)
Prices for solid-state memory will grow in the third quarter (2017-08-24)
By 2020, NVMe will replace SCSI (2017-08-22)
Analysts believe that the new processors from Intel and AMD will revive the PC market in the second half of the year (2017-08-22)
The cost of batteries for laptops will grow by 20 percents (2017-08-15)
TSMC will increase the output of 12-nm NVIDIA products by the end of the year (2017-08-15)
AMD Navi will open the way to multi-chip graphics processors (2017-08-11)

Post Quick Reply:

                                        
Verif code:

                 

computer news computer parts review Old Forum Downloads New Forum Login Join Articles terms Hardware blog Sitemap Get Freebies