Sony Xperia Z5 Premium is equipped with a dual heat pipe
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POSTER: computer news || SONY XPERIA Z5 PREMIUM IS EQUIPPED WITH A DUAL HEAT PIPE |
DATE:2015-09-07 |
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Qualcomm Snapdragon 810 has a pretty bad reputation being branded as one of the hottest in the literal sense word mobile processor. However, not all manufacturers of mobile devices are ready to abandon its use in their flagship. For example, Sony has released the second in a row at flagship on Snapdragon 810 As is known, presented at the IFA 2015 flagship Sony Xperia Z5 is based on the Qualcomm Snapdragon 810, as well as companions in the face Xperia Z5 Compact and Xperia Z5 Premium. Last characterized by the original cooling of the processor. Having examined the Sony Xperia Z5 Premium, you can see that inside the casing in the upper part has a double heat pipe, which is designed to transfer heat and will take care of proper cooling of Snapdragon 810. In addition, to improve the cooling of the smartphone, Sony applied thermal paste. 
How effective will the new system in practice remains to be seen, because the Sony Xperia Z5 Premium will be available in November. Recall that it is the world's first smartphone with a 4K-display (3840 x 2160 pixels), and is also equipped with 3 GB of RAM and 32 GB of internal memory, 23-megapixel main camera and 5-megapixel front.
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SONY XPERIA Z5 PREMIUM IS EQUIPPED WITH A DUAL HEAT PIPE |
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