Colleagues from Hard OCP shared their experiences of removal and return of the lid to the serial processor Core i5-7600K, and in the course of the experiment found that the nuances of the heat spreader mounted after replacement of the thermal interface are important to performance.
Thermal interface was changed to Noctua NT-H1 and CoolLab Liquid Ultra, and if in the first case was able to get six degrees lower under load, the difference in the second thermal interface with the stock increased by 13 degrees Celsius. After replacing the thermal interface and the application of the sealant to the substrate significantly improves the cover contact with other parts of the processor. In addition, the sealant should be allowed to dry, so that gaps remained unchanged.
The perimeter of the substrate sealant must leave a gap for removal of hot air when heated during processing.
By the way, the authors of the material noted that Intel has managed to get the covers Skylake processors smoother surface compared to its predecessors, and now the "outer" thermal interface is more evenly distributed. Remove the cover from the processor and changing the thermal interface, you will not only lose the warranty, but also risk being left with unusable processor. Skylake processors substrate has a sufficiently small thickness. Related Products :
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