Intel this week held an event designed to acquaint the public with its achievements in the field of production technologies and layout of microprocessor products. One of the major revelations of the event was the recognition of Intel ready to use "embedded multichip connecting bridge" (EMIB, from the English. Embedded Multi-Bridge Interconnect The Die ). Accordingto Intel representatives , this approach to the manufacture of computer technology allows us to combine the components on a single
substrate functional units issued by different lithography technologies.
Until now, even the development of processors, consisting of two different crystals, had unwittingly "pull" all to the "lowest common denominator", or use expensive silicon bridge with multiple feedthroughs (this version of the layout is used AMD Fiji GPUs and find application in AMD vega). Both approaches, according to Intel, have their significant disadvantages, so it offers a third - the same EMIB.
Silicon bridge in this case provides a limited number of high-density compounds, wherein he integrated into a substrate on which are arranged diverse type crystals used process. The task of a silicon bridge - to provide a compound of these crystals together. All of this "mosaic puzzle" can be issued for a variety of technical processes.
More addition, Intel recognizes that already uses EMIB in programmable Stratix FPGA-matrices 10, which it is developing forces team of specialists who switched from Altera after the absorption of the latter. Related Products :
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