Intel can supply Skylake-X with the solder under the lid by the end of the year

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POSTER: computer news   ||    INTEL CAN SUPPLY SKYLAKE-X WITH THE SOLDER UNDER THE LID BY THE END OF THE YEAR	DATE:2017-06-19
Intel processors in LGA 2066 version have a chance to register in the desktop systems only a limited number of enthusiasts, since even if there are several models costing less than $ 1000, they require the purchase of a new motherboard and a set of four-channel memory, which significantly increases the budget.  In this sense, the presence of a plastic thermal interface under the cover instead of the customary solder is more likely to cause criticism of the company's production policy, rather than a deterioration in the consumer qualities of specific processors. Italian resource Bits & Chips , citing its own sources, reports that Intel may replace the plastic thermal interface under the cover of the Skylake-X processors by the end of this year or at the beginning of the next one to a more traditional solder for the products of this price segment.  According to the source, to apply a plastic thermal interface on the processors of the "first wave" the company was forced, as it did not have time to work out the technology of soldering the cover for a new family.  However, the priority of price expediency can prevail in the future, and therefore one should not particularly hope for the bindingness of such changes. Related Products :

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