Factory for the production of semiconductors GLOBALFOUNDRIES Fab 8, located in Saratoga (New York, USA), began the process of installing equipment for a three-dimensional layout 20nm chips. This event is a cornerstone in the production of multi-level next generation chips designed for the market of fixed and mobile devices.
Installed equipment will assemble chips on the principle of TSV (Through Silicon Vials). In the silicon wafer vertical holes are filled with copper, which forms a contact pad for the next layer. In this scheme, banks can be placed directly on the microprocessor memory, which significantly increase the throughput, while reducing power consumption. In addition, the use of multi-chip wiring save on the motherboard and materials, simplifying development and reducing the price of finished product. Related Products :
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