Western Digital Corporation starts mass production of 64-layer 3D NAND memory capacity increased

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POSTER: computer news   ||    WESTERN DIGITAL CORPORATION STARTS MASS PRODUCTION OF 64-LAYER 3D NAND MEMORY CAPACITY INCREASED	DATE:2017-02-07
Manufacturers of solid state memory  actively compete in the rate of increase in the number of layers  3D NAND, and the Korean company SK Hynix is ready to start production of 72-layer 256-gigabit chips in the second quarter, and 512-gigabit chip of this type appear at the end of the year. Western Digital Corporation company  said it has started pilot production of a 64-layer 512-gigabit memory chips such as 3D NAND at its Japanese plant, inherited from SanDisk.  By the way, in the development of this memory took part  Toshiba company, so this success is not WDC only  .  The mass production of 512-gigabit chips 3D NAND with 64 layers will begin in the second half of this year. About readyness to produce 64-layer 3D NAND chips Western Digital Corp. announced back in July of last year, and now it is proud to be the first in the industry develops the release of 512-gigabit chips of this type.  This memory will find application in solid-state storage brands Western Digital. Related Products :

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