With the release of Radeon RX Vega video cards, the market for occasions for news has become no less, and this is frankly encouraging, since usually after the publication of reviews, profile topics go deep into conferences. Dutch colleagues from the site Hardware.Info when studying the Radeon RX Vega 64 graphics processors Vega 10 with HBM2 memory attached to the samples managed to find out that some instances have differences in the technological packaging.
The first embodiment does not provide for "pouring" around and between the HBM2 chips and the GPU chip. Moreover, the GPU chip slightly rises above the surface of the HBM2 memory chips, forming a small step.
At the same time, the second version of Vega 10 not only provides for "filling" with a special composition of the gaps between the memory chips and the graphics processor, but also the space around them, but also excludes such a difference in altitude.
Absolutely flat surface greatly simplifies the installation of the cooling system, since the heatsink bottom can be made flat. The "ledge" will also worsen the contact with the memory chips, as they will be remote from the bottom of the cooler.
Some video card manufacturers admitted in an interview to our Dutch colleagues that two different AMD contractors are engaged in packing Vega 10 crystals and HBM2 chips, hence the differences between GPU instances. The manufacturers of video cards will compensate for the difference in heights with additional quantity of thermal interface or thermal pads, but this will not rule out the heterogeneity of the thermal characteristics of video cards.
By the way, the differences in packaging are inherent not only to the samples of Vega 10 separated from the printed circuit board, but also to commodity video cards.
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