Associates removed the heat spreader from A8-7670K .
To do this it was necessary to cut through the sealant on the perimeter of the lid, heat processor using an industrial dryer, and then lift the cover relative to the substrate using a blade .
There is a special solder, which is considered the best thermal interface compared with the thermo plastic.
Some of the solder remained on the cover of heat spreader.
At the same time there is an opportunity to compare the box processors A8-7670K (pictured left) and A10-7870K (pictured right). The latter is much larger because it is more massive regular cooler (pictured right).
A8-7670K processor can be overclocked increasing the multiplier, and the effective thermal interface under the cover allows to hope for the success. Related Products :
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