When developing HBM need to pay attention to memory temperature regimes

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POSTER: computer news   ||   WHEN DEVELOPING HBM NEED TO PAY ATTENTION TO MEMORY TEMPERATURE REGIMES	DATE:2016-08-25
At the Hot Chips conference company SK Hynix and Samsung have paid sufficient attention to the directions of further improvement of memory type HBM - both in terms of productivity and in terms of cost reduction.  However, as noted by AnandTech site, some market participants concerned and other aspects of memory integrated on a single substrate with microprocessors.   For example, a developer of programmable arrays Xilinx claims that the temperature limits  endurance HBM type  memory chips must be enhanced.  8 layout of memory chips of this type, according to the Xilinx, able to raise operating temperatures up to 97 degrees Celsius, and it already requires serious air cooling.  In addition, the large variation in temperature between the workers t can reach 14 degrees.  Accordingly, different "layers" will be have different thermal expansion, and it has to be taken into account. Xilinx now proposes to raise the threshold of allowable temperature for HBM type of memory chips for the limit of 95 degrees Celsius.  In addition, it is necessary to think about effective cooling .  One of the key issues on the agenda of all product developers with memory type HBM - search for alternatives to the silicon bridge which combines memory chips with a microprocessor.  This component is not cheap and difficult to produce.   Related Products :

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